Evan Blass (popular as Evleaks on Twitter) has leaked the press renders of the upcoming flagships from Samsung, the Samsung Galaxy S9 and Galaxy S9+. The company has already sent the media invite for the official unveiling set for February 25th at the Samsung Unpacked event at Mobile World Congress 2018.
While it will be the Qualcomm Snapdragon 845 mobile platform powering the two phones in the U.S., the International market will see the one with Samsung’s Exynos 9810 chipset. According to Evleaks who reported it on Venturebeat, the Galaxy S9 will carry 4GB of RAM and 64GB internal storage while on the other side, the Galaxy S9+ will have a variant with 6GB RAM and 128GB storage.
The Galaxy S9 and S9+, as suggested by the media invite from the company, will have redefined cameras, and it should have the motion-detected, “super slow-mo” video capture. A recent leak of the spec-sheet also shows that the S9 will carry a F/1.5 camera, the smallest in class.
One of the bigger changes, something that people will feel happy about, is the change to the placement of the fingerprint sensor. Samsung had placed it awkwardly just beside the rear camera module on the Galaxy S8 and S8+, but now they seem to have been placed more naturally towards the centre back of the phone. Two other known features now include the presence of stereo speakers on the bottom of the phones, and there will be a 8-megapixel camera for selfies on the front.
As shown on the press shots, the phones could be selling from March 16th after the official unveiling on February 25th.
Source: VentureBeat
new design with smaller bottom chin looks DOPE!! #Honor9LiteGiveaway
That’s too good amazing to have Samasung great work.