Samsung is hot on its heels in making the Galaxy S7 the next Flagship smartphone to take on the market. In the process of making it top notch, there will be the problem of overheating which has been seen in all flagships till date. To counter this problem the Korean giant is looking for the recently introduced cooling technology using heat-pipes in smartphones, successfully implemented by Microsoft in its Lumia devices.
The heat-pipes have been used from a long time in gaming PC’s to control and dissipate the heat produced, this technology is being brought slowly to the smartphone market starting with the Microsoft 950 XL and the Sony Xperia Z5. To keep the high powered devices cooled down while giving their best performance there are tiny pipes which circulate a liquid coolant which carries the heat from the heat producing components like the chipset and spreads it over a larger surface to help cool down faster.
According to Chinese site UDN, Samsung is looking for a heat-pipe supplier to introduce the heat dissipation tech into the Galaxy S7. The company is said to be looking for thin pipes which will not be increasing the thickness of the device and at the same time cool down the Processor. The size which Samsung has in mind is a 0.6mm thick pipe which is what recently Fujitsu announced earlier in March. The company has announced that it will be sandwiching six 0.1mm layers together. Fujitsu claims that this cooling system is five times more effective than previous versions.
Samsung has announced that the Galaxy S7 will be released in two variants unlike the S6 in which there was no Snapdragon chipset, with the Galaxy S7 the company is launching two variants, one sporting the Exynos 8890 processor and the other variant with a Qualcomm Snapdragon 820 chipset. The Snapdragon 820 has been in news for its amazing benchmark scores and it was recently showcased running a device by the company.
